Production
Assembling and inspecting BGA, QFN and LGA
We process BGAs, QFNs, LGAs and many other package types every day in large quantities in a standards-compliant process.
Hidden solder joints under control
With these package types the solder connections lie under the component. That is why, in addition to optical inspection, we check hidden structures on a spot-check basis in the X-ray machine.
When a component has to be replaced
High-pin-count components and components with hidden solder connections can be soldered and desoldered in a process-safe way with our rework station, also as a standalone service.
Part of the SMD line
The components run over our SMD production line with 3D paste inspection, reflow oven and vapour phase in the ESD area.
Frequently asked questions
Do you process BGAs and QFNs?
Yes, we process BGAs, QFNs, LGAs and many other package types every day in large quantities in a standards-compliant process.
Can you replace a BGA?
We solder and desolder high-pin-count components and components with hidden solder connections in the rework station.
Related
Updated: 19 October 2026