L03 · Assembly and soldering
SMD assembly at the highest level
With our pick-and-place machines we build your products from prototype to high-volume series at consistently high quality.
From paste to solder joint
An SMD assembly starts with paste printing. A 3D paste inspection checks the result right here, so errors never reach placement. Then our machines place components from 01005 to 80 x 80 mm at up to 36,000 components per hour.
Soldering takes place in the reflow oven, which can work under oxygen and under nitrogen atmosphere. For thermally more demanding assemblies we also have the vapour phase.
Difficult package types too
We process BGAs, QFNs, LGAs and many other package types every day in large quantities in a standards-compliant process. More at assembling BGA, QFN and LGA.
Lead-free or leaded
Depending on the customer's wish we solder lead-free or leaded. The processes and solders at a glance: lead-free or leaded soldering.
Clean area
Of course, SMD production takes place in a separate, air-conditioned ESD area.
Frequently asked questions
What board size can you assemble?
Our production line handles boards up to 680 x 400 mm with a thickness of up to 5 mm.
How small may the components be?
The pick-and-place machines handle component sizes from 01005 to 80 x 80 mm.
Do you solder lead-free?
Lead-free or leaded, as the customer wishes.
Related
Updated: 19 October 2026